Cooler Master – MasterAir MA620P – CPU AIR COOLER
- Twin-Tower Design
- Exceptional Performance
- Custom Colors
- Wired RGB Controller C10L
- Silent Cooling
DUAL TOWER HEATSINKS & FANS
The dual tower heatsink has a combination of 2 sets of heatsink towers with 2 sets of MasterFan MF120R RGB. The uniquely designed heatsink allows bigger and more spread-out surface area, while the MF120R RGB fans give added air pressure from the outside and inside the heatsink to generate massive cooling performance.
MORE IS BETTER
Add up to 3 fans to accelerate the air pressure and removal of heat with the ‘Push and Pull’. One fan is placed at the front to pull cool air in, the second fan is placed in-between the heatsinks, with the option to add a third to maximize the heat pass-through.
2X MASTERFAN MF120R RGB
The MasterFan MF120R RGB operates quietly even at high speeds. It is designed with a combination of jet engines and helicopter blades for the static air pressure you need without sacrificing airflow.
45% MORE CONTACT WITH CDC 2.0
Continuous Direct Contact Technology 2.0 (CDC 2.0), the contact surface area of heat pipes to the base is increased by 45%. This further enhances the heat transfer mechanism and significantly improves conductance and cooling capability.
MORE HEAT PIPES
MasterAir MA620P has 6 x heat pipes for fast transfer of heat, to make sure the CPU is running at optimal performance. Combined with the twin tower and dual fan design, you can even maximum TDP for the extreme overclockers.
RGB LED ILLUMINATION
A wired RGB LED controller is included 100M to personalize the RGB lighting anytime you want (no software needed). Switch it up depending on your mood, the possibilities are not limitless.
QUICK AND EASY INSTALLATION
Tool-free mounting kit makes installation a breeze. Universal retention brackets are included, with full compatbiliity for:
Intel© LGA 1151 / 1150 / 1155 / 1156 / 1366 / 775
AMD© AM4 / AM3+ / AM3 / AM2+ / AM2 / FM2+ / FM2 / FM1
|CPU SOCKET||LGA2066, LGA2011-v3, LGA2011, LGA1366, LGA1200, LGA1156, LGA1155, LGA1151, LGA1150, LGA775, AM4, AM3+, AM3, AM2+, AM2, FM2+, FM2, FM1|
|HEAT SINK DIMENSIONS (L X W X H)||116 x 110.1 x 165 mm / 4.6 x 4.3 x 6.5 inch|
|HEAT SINK MATERIAL||6 Heat Pipes, CDC 2.0, Aluminum Fins|
|HEAT SINK WEIGHT||850g / 1.87lb|
|HEAT PIPE DIMENSIONS||0.6mm|
(L X W X H)
|120 x 120 x 25 mm / 4.7 x 4.7 x 1 inch|
|FAN SPEED||600-1800 RPM ± 10%|
|FAN AIRFLOW||53.4 CFM ± 10%|
|FAN AIR PRESSURE||1.65 mmH2O ± 10%|
|FAN MTTF||160,000 Hours|
|FAN POWER CONNECTOR||4-Pin (PWM)|
|FAN NOISE LEVEL:||31 dBA (Max)|
|FAN RATED VOLTAGE||12VDC|
|FAN RATED CURRENT||0.30A|
|FAN SAFETY CURRENT||0.37A|
|FAN POWER CONSUMPTION||3.6W|
|COOLER TYPE||Air Cooler|